+ Wedge, Ball, Bump and Ribbon bonding
+ 17u to 75u Wire and 25u x 250u Ribbon
+ 4,3” TFT Display & Multi Button
+ Deep-Access Wedge 16mm / Ball 13mm
+ Bond Arm Length 165mm
+ Motorized Tail Control
+ 20 Program Storage Capacities
+ Electronic Ball Size Control
HB05 Thermosonic Wire Bonder for Wedge & Ball Bonding
The HB05 is a Bench Top Size Wire Bonder, ideal for laboratories and pilot production lines.
One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT Display, direct access and simple adjustment of all bond parameters.
Technical Specifications
Bonding Methode
Gold wire diameter
Aluminium wire diameter
Ribbon size
Ultrasonic system
Utrasonic power
Bond time
Bond force
Bonding tool
Motorised Wire Spool
Wire termination
Wire feed angle
Clamp movement
Ball size control
Throat depth
Fine Table motion
Mouse ratio
Temperature controller
Electrical Requirements
Physical Dimensions
Weight
Industry Standards |
Wedge-Wedge, Ball-Wedge, Ribbon- & Bumb- bonding
17-75u (0,7-3 mil)
17-75u (0,7-3 mil)
max. 25 x 250u (1x 8 mil)
62 kHz Transducer PLL Control
0-5 Watt Output
0 - 1 sec.
5-130 cNm
1,58 ? 19 mm length (0,0624” x 0,750")
50,8 mm ( 2")
Bond Head Tear
90°
Motorized, Up / Down
Electronic
165 mm ( 6,7")
10 mm ( 0,4")
6:1
up to 250°C +/- 1°C
100 - 240V +/-10% 50/60 Hz 10A max.
550 x 450 x 250mm
Net 25 kg
CE standards |
